MPi Canteliver Probe Cards
Canteliver Probe Card
MPI Cantilever Probe Card is extensively used on gold bump and pad wafer testing for Screen driver, logic, and memory device. MPI’s cantilever probes are definitely the corresponding reply to your requires of fine pitch, small pad dimension, significant velocity, much less cleaning, multi-DUT, substantial pin depend, and extremely-small leakage requirements. With exceptional craftsmanship, impressive architecture and tested methodologies according to mechanical and electrical simulation/measurement final results, producing MPI the very best cantilever supplier around the globe.
FCB Probe Card
The FCB Probe Card is considered the most experienced technological innovation of buckling beam probe card. It can be aimed to accomplish the semiconductor ship manufacture time-to-current market (TTM) and value of examination (COT) desire. FCB can be a verified Remedy for many different semiconductor manufacturing tests from early engineering pilot-operates to significant volume manufacturing (HVM). FCB is prepared for system necessitating higher sign integrity probing (SI) and/or electric power integrity probing (PI). Apps include things like slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and even more. FCB guarantees the whole world’s finest Total Price-of-possession (COO) for a variety of DUT applications.
EVS Probe Card
The EVS Probe Card is an improvement above the standard buckling beam probe card. Essential functions are better current carrying capacity (C.C.C.) and decreased balanced Get hold of power (BCF), and Total MEMS-like characteristics. EVS can certainly meet the necessity of advanced wafer probing. Exact alignment and excellent planarity Management would be the critical elements contributing to steady Call resistance. With its capability and effectiveness, EVS Probe Card is a perfect option for advanced probe cards.
Osprey probe card
The Osprey probe card is MPI’s Option to demand for ever finer pitch. It truly is suitable for smaller sized Al pad, which is perfect for very small pitch application with peripheral and total array sample. With exact alignment and improved planarity Manage, Osprey can achieve better efficiency by multi-DUT design. The forming wire (FW) kind needle developed with MPI’s individual micro fabrication system not only delivers large-good quality effectiveness but will also allows simple needle replacement and shortens sustaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle which can be made for the need of minimal power probing. In addition, it comes more info with the chance to satisfy high C.C.C. and superior pin counts software. The MEMS course of action makes certain remarkably regular needle attributes, along with the Particular construction design permits exact alignment and planarity Handle.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
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